ResoBond MS Polymer Adhesive – 290ml Cartridges – High Performance Glue For Bonding Porous To Non Porous Surfaces

MS Polymer adhesive has been specifically formulated to improve the bond between the cover board and chipboard during the curing process. It helps draw the two substrates together while curing and remains semi-flexible once cured, allowing for minor differential movement between the chipboard substrate and cover boards without compromising the bond.

Application Guidelines
The adhesive is supplied in 290ml cartridges and should be applied using a standard caulk/mastic gun.

For optimum performance:
Cut the nozzle to produce a 3mm bead.
Apply the adhesive in continuous straight beads.
Install two parallel beads approximately 75mm apart between each routed pipe channel.
Ensure the cover boards are laid immediately after application to maximise wet adhesion.
Approximate coverage is 1.8m² per cartridge, depending on bead size and application method.